产品详情:
国内现货供应EM TG97-3模块,
原装进口,现货.
联系人:许先生 13366236066 QQ:415780729 MSN:xu__guang@hotmail.com(注:XU后面两个下划线,加我请注明是TG97-3)
1、系统移植
2、CPU芯片供应
3、卡片制造
4、售后跟踪
应用领域:应用于医保、社保、银行、电信、加油、会员消费、金融、高速公路收费等领域。
Environment
Voltage Supply Class A, B: 3.0V to 5.0V ± 10%
-25 to +85 °C Operating Temperature
Max supply current 6mA @ 15MHz, Class B
> 4 kV ESD Protection HBM
CPU
Software compatible CMOS 80X51 industry standard
Accelerated architecture with 16 bit CPU performance level
Up to 30 MHz internal CPU clock
Idle Modes
Idle and Stop mode selectable modes
NVM update operation with CPU in idle mode
IO Transmission and Reception with CPU in idle mode
Max Idle current / Clock stopped: 100 uA
Security
Hardware Random Number Generator FIPS140-2
Unique chip identification number
Notification of tampering
IC operates under regulated voltage and internal clock
DPA/SPA resistance mechanisms
Under / Over voltage sensors (Vcc)
Memory Control
General Purpose Non Volatile Memory: GPNVM
Secure Memory Management Mechanism
Fast Byte program: 40 us / Byte
GPNVM Page Erase: 2 ms
I/O
ISO 7816-3 compliant electrical interface
ISO 7816-3 compliant interface with T=0 and T=1 protocols
ETU Timer/Counter replacing 8051 T0/T1 Timers
Memories
1024 bytes RAM (256B Local RAM + 768B XRAM)
56KB GPNVM (User) = 448 pages of 128 bytes
User Code, constant storage (ROM)
User Non Volatile Data storage (EEPROM)
1KB GPNVM (System) = 8 pages of 128 bytes
System parameters
Loader extensions
Backup buffer / hard API code
10 year data retention for EEPROM / OTPROM
GPNVM Cycling Endurance > 100 K cycles
BootROM loader T0 and T14 compatible
Boot loader commands set extension capabilities
Chip Forms
8” Wafer sawn or unsawn
Back grinding and distressing options
180 microns max thickness
Modules
Typical Application:
SIM card GSM Phase2+ 32KB